Anza Technology, Inc. filed a complaint for patent infringement against its competitor Xilinx, Inc. on March 16. Anza accuses Xilinx of infringing U.S. Patent No. 7,389,905 B2, entitled “Flip Chip Bonding Tool Tip,” U.S. Patent No. 6,935,548 B2, entitled “Dissipative Ceramic Bonding Tool Tip,” and U.S. Patent No. 6,354,479 B1, entitled “Dissipative Ceramic Bonding Tool Tip.” Anza accuses Xilinx’s Spartan, Virtex, Kintex, Artix, and Zynq families of ICs of infringement, along with printed circuit boards that are bonded with these ICs.
Anza is represented by Anton N. Handal of Handal & Associates, San Diego, CA.
The complaint is available here.